Industry’s Broadest Line of Automotive-Grade Devices Meets Growing Demand for Seamless In-Vehicle Connectivity
News Highlights:
- Continues Broadcom momentum in fast-growing connected car market
- Highly integrated devices optimized for automotive infotainment and telematics systems
- Enables end-to-end ecosystem support for wide range of mobile devices and wearables
Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced 
two new connectivity chips in its automotive portfolio. Broadcom’s automotive-grade wireless chips, featuring the latest in 5G WiFi and Bluetooth Smart technology, enable car makers and tier one integrators to keep pace with the speed and growth of consumer electronics and Internet of Things (IoT) industry. The new solutions deliver high-speed connectivity within and beyond the vehicle, providing Internet, cloud applications and entertainment content via telematics or hot spot connections. For more news, visit Broadcom’s Newsroom.
Broadcom now offers the industry’s first 5G WiFi/Bluetooth Smart 2X2 MIMO combo chip with Real Simultaneous Dual Band (RSDB) support as well as a stand-alone tri-mode Bluetooth Smart (version 4.2) system-on-a-chip (SoC). Optimized to meet the rigorous standards of the automotive industry, all products have been tested to AECQ100 automotive environmental stress requirements, are manufactured in TS16949 certified facilities and offer full production part approval process (PPAP) support.
“Broadcom’s new automotive-grade chips enable car makers and tier one suppliers to keep pace with the rapidly evolving mobile and IoT ecosystem by providing immediate access to the latest in wireless connectivity technologies,” said Richard Barrett, Broadcom Director of Automotive Wireless Connectivity. “By tailoring our products to meet the stringent quality and environmental demands of the automotive industry, we can significantly expand our footprint and stay ahead of the competition in this fast-growing market.”
At the heart of the connected car are the semiconductor chips that make connectivity possible. As the development cycle quickens, analysts predict that the number of chips used in vehicles will rise at a dramatic pace. According to recent analyst data from Strategy Analytics, there could be nearly 1,000 chips per vehicle by 2020.
“Car connectivity is becoming the new battleground for product differentiation in the highly competitive automotive market,” said Strategy Analytics Richard Robinson, Automotive Communications and Multimedia Service Director. “By combining the same technology associated with the fast-moving mobile and IoT ecosystem with the stringent requirements of the automotive industry, Broadcom is well positioned to strongly compete in the rapidly growing automotive IC market.”
