At the 2013 International Test Conference, GOEPEL electronic, world-class Boundary Scan vendor and iSYSTEM, innovative tool provider for embedded software design announce the market introduction of another new development within the framework of a long-term strategic cooperation for Embedded System Access (ESA) technologies.
The innovation named iTIC seamlessly integrates a complete on-chip debugger in the form of a TAP Interface Card (TIC) into the ESA hardware platform SCANFLEX® for the first time. On this basis, it brings together technologies for non-intrusive software and hardware validation and test with unprecedented compatibility.
The iTIC, controlled via the TAP Interface Cards’ internal standard interface, supports all procedures for software debugging as well as any technologies for Embedded System Access, such as Boundary Scan, Processor Emulation Test, FPGA Assisted Test and in-system programming of Flash and PLD.
The new iTIC is a highly important milestone for the holistic implementation of our Embedded System Access philosophy. The successful cooperation with our long-term, partner iSYSTEM enables us to support a considerably higher number of microprocessors and, furthermore,exploit synergies between different applications to an even greater degree”, says Thomas Wenzel, Managing Director of GOEPEL electronic’s JTAG/Boundary Scan Division. “The opportunity to execute all procedures on one platform brings users added efficiency in design validation and flexibility in test throughout the entire product life cycle.
In recent years, we systematically extended our tools‘ connectivity for embedded software development and test and associated partnerships with vendors of complementary products to create significant added values in operational efficiency and performance for our customers“, explains Erol Simsek, CEO with iSYSTEM AG. “Based on the intensive cooperation with GOEPEL electronic as market leader for Embedded System Access technologies, we will continue this course, and, additionally, extend our activities as OEM vendor.