A new image claimed to show the schematics of Apple’s upcoming iPhone 6s handset has leaked to the Web. The schematics go in line with the previously leakedmeasurements revealed by a case maker.
A source close to Apple’s supply chain in China, in the image shared by Engadget Japan, has shown the upcoming smartphone to be 7.1mm thick, 0.2mm thicker than iPhone 6, along with 138mm height and 67mm width. This means that the new handset would be able to fit in most of the cases made for current iPhone 6 model, and is only marginally bigger.
Last week, a leak also suggested the iPhone 6s Plus would be 7.13mm thick, 0.03mm thicker than iPhone 6 Plus. As speculated before, the extra thickness here hints towards the inclusion of Force Touch feature in the models – something also tipped by KGI analyst Ming-Chi Kuo.
Meanwhile, a Chinese blog named Micgadget (via 9to5Mac), claims Apple’s iPhone keynote event to launch the iPhone 6s and iPhone 6s Plus will be on September 11 (a Friday), and will hit the shelves starting a week later on September 18. As per the website, the date come via sources in Foxconn’s supply chain.
The keynote date seems unlikely, as Apple normally announces its handsets earlier in the week to encourage news coverage ahead of the weekend rush.
Details for the handset’s new logic board, NFC chip, LTE connectivity, camera detailsand more have been leaked in the last couple of weeks.
Source-NDTV
