USHIO INC., (TOKYO: 6925) (President and CEO: Shiro Sugata) today announced that the company has booked the large-field stepper “UX7-3Di LIS 350” for manufacturing interposers used for 2.5D/3D packaging applications, and will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month.
The UX7-3Di LIS 350, the latest model of the UX7-3Di interposer stepper series, has achieved an industry-leading resolution of 2 µm L/S on a 300-mm Si wafer as well as an organic substrate. Mounted with a proprietary alignment mechanism, the UX7-3Di LIS 350 is able to address a warp or expansion/contraction of an organic substrate, thus being optimized for manufacturing 2.5D/3D interposers made of organic substrates that have recently become popular, other than Si wafers.
“For high-volume production of 2.5D/3D interposers, we have introduced a stepper capable of processing not only Si wafers but also square substrates including glass and organic substrates. Utilizing this UX7-3Di LIS 350 stepper allows significant reduction of the interposer manufacturing cost, which ultimately leads to reduction of the manufacturing cost of final products such as smart phones and tablet PCs,” commented Masayuki Itaba, General Manager of the Exposure Business Unit, USHIO INC.
In order to meet the further need for finer circuit patterns, USHIO is currently developing a large-field precision projection lens that can produce a super-high resolution of 1 µm L/S.
Under the slogan “Advanced Packaging Solutions”, USHIO will exhibit a series of its lithography systems for advanced packaging applications, including the UX7-3Di LIS 350 stepper, through a panel display at SEMICON West 2013, to be held on July 9 through July 11 at Moscone Center in San Francisco, California (Booth # 2241).
Source-Efytimes
