MediaTek has expanded its Dimensity 6000 series with the introduction of the Dimensity 6100+ chipset. This new chipset follows the release of the Dimensity 6020 and 6080 chipsets.
The Dimensity 6100+ features two high-performance Arm Cortex-A76 cores and six energy-efficient Arm Cortex-A55 cores. It offers support for advanced AI-powered cameras, 10-bit displays, and enhanced graphics performance, resulting in an improved user experience.
MediaTek has expanded its Dimensity 6000 series with the introduction of the Dimensity 6100+ chipset. This new chipset offers support for LPDDR4x memory and UFS 2.2 storage, and can be paired with Mali-G57 MC2 for enhanced graphics performance.
It also provides a seamless and immersive user experience with support for frame rates ranging from 90Hz to 120Hz. The chipset is equipped with MediaTek HyperEngine 5.0 gaming technology, ensuring smooth performance during gaming.
In terms of camera capabilities, the Dimensity 6100+ supports Non-ZSL cameras with up to 108MP and offers AI-bokeh camera features for impressive selfies. It also incorporates MediaTek’s AI-colour technology in partnership with Arcsoft.
The chipset features an improved 5G modem that supports the 3GPP Release 16 standard, allowing for faster data transfer rates. It also includes UltraSave 3.0+ technology, which reduces 5G power consumption.
The Dimensity 6100+ chipset provides multiple connectivity options and is set to be released in smartphones in Q3 2023. Earlier this year, MediaTek introduced the Dimensity 6020 and Dimensity 6080 chipsets, which offer similar features such as support for gaming technology, dual 5G SIM, LPDDR4x RAM, and UFS 2.2 storage.
