MediaTek has unveiled its latest flagship chipset, the Dimensity 9400, designed to deliver top-tier performance and efficiency for smartphones. This fourth-generation SoC in the Dimensity lineup is optimized for edge-AI applications, immersive gaming, superior photography, and more. Built on Arm’s v9.2 CPU architecture, the Dimensity 9400 features the advanced second-generation All Big Core design, combining a Cortex-X925 core with three Cortex-X4 and four Cortex-A720 cores. This powerful architecture delivers a 35% boost in single-core and a 28% increase in multi-core performance compared to the previous Dimensity 9300.
Utilizing TSMC’s second-generation 3nm process, the chipset is also 40% more power-efficient than its predecessor, ensuring longer battery life. MediaTek President Joe Chen highlighted the company’s commitment to empowering AI-driven applications and advancing generative AI technology, with features like on-device LoRA training and video generation.
The Dimensity 9400’s 8th-generation NPU sets new standards for AI performance, offering significant improvements in large language model (LLM) prompt efficiency while consuming less power. It also introduces the Dimensity Agentic AI Engine (DAE), enabling seamless interaction between AI agents, apps, and cloud services, simplifying the development of advanced AI applications.
For gamers, the 12-core Arm Immortalis-G925 GPU delivers 40% faster raytracing and a 41% peak performance boost, while cutting power consumption by up to 44%. The Dimensity 9400 also enhances photography with its Imagiq 1090 ISP, offering HDR video recording throughout the zoom range and reducing power usage during 4K video capture.
Other notable features include a 5G modem with up to 7Gbps speeds, Wi-Fi 7 support, and capabilities for dual SIM dual active data, making it an ideal choice for upcoming smartphones. The first devices with the Dimensity 9400 chipset are expected to hit the market in Q4 2024.
