Polymatech Electronics, a leading player in India’s opto-semiconductor chip sector, has signed a Memorandum of Understanding (MoU) with Japan’s Orbray Co. Ltd, signaling a significant milestone in the company’s ambition to become a comprehensive semiconductor entity.
Under the agreement, Orbray will provide training to Polymatech Electronics engineers at its advanced facility in Japan, facilitating knowledge exchange and skill enhancement. Additionally, Polymatech Electronics has secured sapphire ingot growing and wafer fabrication machinery, scheduled for deployment at its Chennai plant by March 2025.
Sapphire ingot technology involves the cultivation of large, high-quality sapphire crystals crucial for semiconductor applications.
Expressing his enthusiasm, Eswara Rao Nandam, Managing Director & CEO of Polymatech Electronics, emphasized the MoU’s importance in advancing the company’s transformation into an end-to-end semiconductor provider. He hailed the partnership as a significant milestone in Polymatech’s growth trajectory, enabling the conversion of ingot into finished products.
Orbray, with over 85 years of experience in precision components manufacturing, is globally renowned for its expertise in optical fiber components, Sapphire Wafers, and micro-motors, operating across multiple facilities worldwide.
Polymatech Electronics has been India’s sole developer, manufacturer, and packager of opto-semiconductor chips since 2019. These chips, capable of emitting or detecting light, are crafted from specialized materials like silicon or germanium, enabling unique interactions with light. The company primarily focuses on light-emitting diodes (LEDs) and light-detecting devices.
With a growing clientele across the US, EU, and MENA regions, Polymatech Electronics currently boasts a production capacity of 2,000 million chips. These chips are manufactured at its facility in Oragadam, Tamil Nadu, with exports exceeding $125 million in the fiscal year 2023-24.
Polymatech Electronics specializes in the design, manufacture, packaging, and assembly of semiconductor chips and chip modules, catering to diverse applications ranging from medical and agriculture to large-area lighting, PCs, laptops, and cell phone backlights.
