TAIPEI, Taiwan, May 9, 2014 – ASRock Inc., the global leading motherboard manufacturer, unveils the brand new Intel® 9 series motherboards with ASRock Super Alloy technology! Packing the Intel® Z97 / H97 chipsets, ASRock 9 series Super Alloy motherboards provide great compatibility and fully support the 5th, New 4th and 4th Generation Intel® Core™ Processors in Socket 1150. The product lines include the Extreme series for high-end PC, the Fatal1ty Killer Gaming series for elite gamers, and the OC Formula series for OC enthusiasts.
Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. The 9 series motherboard are specially designed with ASRock Super Alloy technology, including 12K Platinum Capacitors with the longest lifespan in the industry, the next-gen NexFET™ MOSFET, Dual-Stack MOSFETs (DSM), Premium Alloy Chokes, and XXL Aluminum Alloy Heatsinks. Clearly, ASRock has shown its ambition to redefine the horizon of motherboard craftsmanship.
12K Platinum Caps ─ Industry’s Longest Lifespan
Supreme 12K platinum capacitors with the longest life spans in the industry. These high class capacitors possess not only eye-catching appearances, but also ultra durability of at least 12,000 hours.* Compared to other counterparts on high-end motherboards that merely have life spans of around 10,000 hours, these platinum capacitors have 20% longer life spans and provide more stability and reliability.
* Tested under industry standard 105 degree Celsius ambient temperature.
NexFET™ MOSFET For Memory Power ─ Lower Temperature, Higher Efficiency, Better ESD Protection
The next-generation NexFET™ MOSFETs control the power supply to DRAM slots more efficiently. They provide lower RDS(on) 2.9 mΩ, delivering higher efficiency and lower temperature. NexFET™ MOSFETs in memory areas are specially designed for protecting them from electrostatic discharge and offering up to 7.5 times the ESD protection levels compared to traditional MOSFETs.
Dual-Stack MOSFET For CPU Power ─ Coolest Temperature & Most Efficient Power Delivery
Dual-Stack MOSFET (DSM) is another innovative MOSFETs design. The silicon die area is increased by stacking two dies into one MOSFET. The larger the die area, the lower Rds(on). Compared to traditional discrete MOSFET, DSM with larger die area provides extreme lower Rds(on) 1.2 mΩ, so the power supply for the CPU Vcore is more efficient.
Premium Alloy Chokes ─ Highly Magnetic & Heat Resistant Design
The new generation alloy chokes effectively increase up to 90% saturation current and feature a highly magnetic and heat resistant design, making the motherboard more efficient, stable and reliable. Compared to other motherboards that adopt iron powder chokes, Premium Alloy Chokes highlight a special alloy formula which is able to reduce up to 70% core loss.
XXL Aluminum Alloy Heatsink Design ─ Greater Heat Dissipation
The extra large aluminum alloy heatsinks take away heat dramatically. As the MOSFETs and chipsets areas are well covered by these massive heatsinks to protect them from overheating, MOSFETs and chipsets can perform with lower temperature, and your motherboard and system will be more stable and reliable.
With these luxurious onboard components, all 3 product lines of ASRock 9 series Super Alloy motherboards possess not only splendid appearances and outstanding performance, but also excellent stabilities and reliabilities. Whether you are a high-end PC user, a hardcore gamer, or a pure OC demon, as long as you are looking for a new motherboard to take advantage of the next generation of Intel® technologies, ASRock 9 series Super Alloy motherboards are definitely the best products that you should never overlook!
For more information, please visit:
http://www.asrock.com/microsite/intel9/
Contact Information
Jeff Hong
Marketing Department
TEL: +886-2-28965588 ext.11732
FAX: +886-2-28931557
http://www.asrock.com
E-mail: [email protected]
